型号
Custom PCB & PCB Assembly
最小孔径
0.1mm(4mil)for HDI / 0.15mm(6mil)
最小线宽
0.075mm/0.075mm(3mil/3mil)
表面处理
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
Layers
Single Sided,2 to 18 Layer
Compound material lamination
4 to 6 layers
Maximum dimension
610 x 1,100mm
Board thickness tolerance
±10%
DK thickness
0.076 to 6.00mm
Outer layer copper thickness
8.75 to 175OZ
Drilling hole diameter
0.25 to 6.00mm
Laser drill hole size
0.10mm
Solder mask type
Green, Yellow, Black, Purple, Blue, White and Red
Minimum solder mask
0.10mm