材料
C7025 SUS301 H-Copper Alloy
Plating specification
Tinning of contact points
Current Rating
40A Max. AC/DC
Contact Resistance
≤20MΩ Max
Pressure connection diameter
0.2- 0.5/1.0-2.5/2.5-4.0
Temperture Range
-40℃ to +125℃
OD
1.3-1.6/2.1-2.9/2.7-3.7
Four guidelines
Brass/nickel/gold plated surface