Polish
Single side polished (SSP) / Double side polished (DSP)
Orientation
C plane (0001) off angle toward M-axis 0.2 ± 0.1°
Structure
0.2μm pGaN/0.5μm MQWs/2.5μm nGaN/2.0μm uGaN
Dislocation density
< 5 * 10^8 cm-²
Useable Area
> 90% (edge and macro defects exclusion)
Package
Packaged in a cleanroom in a single wafer container