适用行业
维修店, 生产车间, 零售业, 施工工地, 能源矿产
核心组件
Infrared preheating board
用途
mobile phone/laptop BGA/IC rework and repair
Electrical Material
Touch screen+Temperature control module+microcontrollers
PCB size
Max 300mm*280mm Min 10mm*10mm
BGA Chip Size
Max 60mm*60mm Min 1mm*1mm
Heater power
Upper temp.one 800w,second temp.zone1200w,IR temp.zone 1800w
After Warranty Service
Video technical support
After-sales Service Provided
Online support