用途
mobile phone/laptop BGA/IC rework and repair
Function
Repair Motherboards
BGA Chip Size
Max.70*70mm / Min 1*1Mm
Heater power
Upper temp.one 1200w,second temp.zone1200w,IR temp.zone 2700w
Machine Type
Welding Positioner
Product name
chip soldering and desoldering machine
Electrical Material
Driving motor+PLC smart temp.controller+ HD camera
PCB size
Max410*380mm Min10*10mm
Available BGA Chip
Max: 70*70mm